High-performance gaming CPUs experience rapid thermal spikes during demanding gaming sessions, causing thermal throttling, reduced frame rates, and shortened component lifespan. Traditional liquid cooling systems often struggle with instantaneous heat loads due to their reliance on steady-state cooling mechanisms.

Develop an innovative hybrid liquid cooling solution with an integrated phase-change heat spreader that dynamically responds to instantaneous CPU heat spikes, significantly improving temperature control, enhancing gaming performance, and prolonging CPU life.

Hybrid Phase-Change Cooling Block:

• Integrates a small volume of phase-change material (PCM) directly above the CPU Integrated Heat Spreader (IHS).

• PCM quickly absorbs instantaneous heat spikes during heavy gaming loads, reducing peak CPU temperatures.

Adaptive Liquid Flow Rate Control:

• A microcontroller-driven pump system dynamically adjusts coolant flow rate based on real-time CPU temperature readings.

• Optimizes energy efficiency and reduces noise at lower loads while maximizing cooling during peak gaming moments.

3D-Printed Microchannel Cold Plate:

• Custom-designed microchannels using metal additive manufacturing (e.g., aluminum or copper alloys) for optimized thermal conductivity and efficient heat transfer.

• Microchannel geometry optimized through CFD simulations to maximize fluid surface interaction and minimize pressure drop.